1. The drawing die blank and the die steel sleeve are not symmetrically inlaid, and the inlaid cemented carbide steel sleeve is unevenly distributed and has gaps, which can easily lead to U-shaped cracks in the wire drawing process of the die.
2. During the laser drilling process of the diamond die blank, the sintering traces are not cleaned up or the force is uneven, which will cause pits in the diamond die during the drawing process.
3. Unreasonable die hole design, too small opening in the lubrication area at the entrance, and too long sizing belt will cause poor lubrication during the drawing process, resulting in accelerated die wear and even chipping.
Improper use of factors in the wire drawing process leads to rapid wear of the mold:
1. The compression rate of the drawing process surface is too large, which leads to cracks or breaks in the mold. Most of the cracks or broken cracks are caused by the release of internal stress. In any material structure, the existence of internal stress is inevitable. The internal stress generated when the wire is drawn can enhance the microcrystalline structure of the mold, but when the compression rate of the drawing surface is too large, it cannot be lubricated in time and the temperature rise is too high. Part of the material on the surface of the mold is removed, and the stress on the microcrystalline structure is greatly increased, making it easier to crack or break.
2. The drawing axis of the wire is asymmetrical with the center line of the die hole, resulting in uneven stress on the wire and drawing die, and the impact generated by mechanical vibration will also cause high stress peaks on the wire and drawing die, both Will accelerate the wear of the mold.
3. Factors such as uneven hardness of the wire due to uneven annealing can easily cause premature fatigue loss of the diamond wire drawing die, and produce ring grooves to accelerate the wear of the die hole.
4. Rough wire surface, surface adhesion of oxide layer, sand or other impurities, etc. will cause the mold to wear out too quickly. When the wire passes through the die hole, the hard and brittle oxide layer and other adhering impurities will cause the wire drawing die hole to wear quickly and scratch the surface of the wire like abrasives.

5. Poor lubrication or metal debris impurities in the lubricating fluid cause mold wear. Poor lubrication will cause the surface temperature of the die hole to rise too fast during wire drawing, and the die crystal grains will fall off, resulting in damage to the die. When the lubricating fluid is not clean, especially containing metal chips that fall off during drawing, it is very easy to scratch the surface of the die hole and the surface of the wire.