The diamond wire drawing die and its equipment have undergone four generations of changes. From the initial mechanical grinding type, the performance is extremely low, and the mold hole shape is poor. It becomes the current precision integrated piezoelectric ultrasonic electric spark machining technology. And the equipment, the performance is characterized by the diamond wire drawing die processed by it with good hole shape and high surface finish. When processing large-aperture polycrystalline diamond molds, the processing efficiency is doubled if combined with electric spark.

So far, diamond wire drawing dies and their equipment used to make wire and cable have undergone four generations of changes. The first generation is a mechanical grinding type, which uses mechanical grinding to manufacture and repair diamond wire drawing dies. The efficiency of this method is extremely low, and the grinding die has poor hole shape, which has been rarely used.

The second generation is a magnetostrictive type of electron tube, which converts the electrical signal provided by the tube amplifier into mechanical energy through a magnetostrictive transducer for grinding the diamond mold. A disadvantage of this type of machine is that the conversion efficiency of the magnetostrictive transducer is too low and requires external circulating cooling water to cool it. The equipment failure rate is high, and there are not many manufacturers currently in use.

The third generation is a transistor piezoelectric type, which converts the electrical signal provided by the transistor power supply into mechanical vibration through the piezoelectric ceramic transducer. The advantage is that the piezoelectric ceramic has high conversion efficiency and does not require an external cooling system. The volume of equipment has been reduced. So far, this type of machine has been used most, and it has gradually replaced the old mechanical grinding machine and the electron tube magnetostrictive grinding machine, becoming the mainstream of mold manufacturing equipment. The disadvantages include: the harmonic distortion of the transistor circuit is large, and the transducer is easy to produce transverse vibration. When the natural diamond micro-aperture mold is manufactured by such a model, the diamond is easily broken and broken, and the yield is low. At high power output, the transistor is easily damaged and cannot be used to make a super-large aperture polycrystalline diamond wire drawing die.

The fourth generation is a precision integrated piezoelectric ultrasonic electric spark composite processing technology and equipment, which was developed and developed by Beijing Electric Processing Research Institute. This type of machine uses high-power top-level audio integrated circuit, with micro-precision electric spark power supply through the piezoelectric ceramic titanium alloy transducer conversion, ultrasonic and electric spark composite processing of diamond wire drawing die. It is characterized by a high-fidelity audio amplifier chip that provides ultrasonic signals. The internal circuit is powerful, including automatic gain control circuit (AGC), temperature overheat protection circuit, load short circuit protection circuit, and has the advantages of small total harmonic distortion and low noise. . Titanium alloy transducers have low impedance, high q value, low internal loss, high mechanical strength, long life, stable performance and higher conversion efficiency. The combination of the best sound circuit and the piezoelectric ceramic titanium alloy transducer produces very pure ultrasonic waves with no clutter and transverse vibration. The diamond wire drawing die processed by the hole has good hole shape and high surface finish. When processing large-aperture polycrystalline diamond molds, the processing efficiency is doubled if combined with electric spark.

The fourth generation of precision integrated piezoelectric ultrasonic processing machine. The Beijing Electric Processing Research Institute was first developed at the end of 1991 and was quickly applied to the field of diamond wire drawing mold manufacturing. The first batch of machines was model bdc-50a. The purpose of the development was to improve the precision of the natural diamond micro-aperture mold, so that the base roundness and hole type accuracy reached sub-micron level, and the surface roughness reached the mirror level.